水晶管
石英プレート
石英ロッド
光学アプリケーション
半導体産業
研究室および化学用途
Quartz laser-drilled glass plates refer to products in which holes are created on quartz glass plates using laser drilling technology. Quartz glass, due to its excellent properties such as high light transmission, high hardness, high-temperature resistance, and corrosion resistance, is widely used in many fields. Laser drilling technology, with its high precision, high efficiency, and non-contact nature, has become an important method for processing quartz glass plates.
The principle behind laser drilling of quartz glass plates mainly involves using a high-energy density laser beam to focus and locally heat the quartz glass. This causes the quartz glass to undergo thermal expansion, thereby creating holes at the designated locations. The high energy and precise focusing of the laser beam result in a highly accurate and rapid processing, while also avoiding material damage and stress concentrations that can occur with traditional mechanical drilling methods.
| 物件内容 | 資産価値 |
|---|---|
| 二酸化ケイ素 | 99.99% |
| 密度 | 2.2×10³ kg/cm³ |
| 硬度 | 5.5 - 6.5 モース硬度 570 KHN 100 |
| 引張強度 | 4.8×10⁷ Pa (N/mm2) (7000 psi) |
| 圧縮強度 | >1.1×10⁹Pa (160,000 psi) |
| 熱膨張係数 | 5.5×10-⁷cm/cm-°C (20°C-320°C) |
| 熱伝導率 | 1.4 W/m-°C |
| 比熱 | 670 J/kg-°C |
| 軟化点 | 1730度C（3146度F） |
| アニーリングポイント | 1210度C（2210度F） |
| ストレイン・ポイント | 1120度C（2048度F） |
| 作業温度 | 1200°C |
| 電気抵抗率 | 7×10⁷Ωcm (350°C) |
| サイズ | カスタマイズ |
| ロゴ | カスタマイズされたロゴ |
JGS1
Commonly known as UV-grade fused silica, this material exhibits exceptionally low dispersion and very high transmittance in the ultraviolet (UV) spectral range.
JGS2
Similar to JGS1, but may have variations in specific performance parameters such as transmittance and thermal expansion coefficient, depending on the manufacturer’s standards.
JGS3
Typically used in applications requiring higher purity or specialized performance characteristics. Specific performance parameters can vary based on the manufacturer.
High Precision
Laser drilling technology can achieve processing precision at the micrometer and even nanometer level, meeting the requirements of high-precision applications.
High Efficiency
Laser drilling speeds are much faster than traditional mechanical drilling methods, significantly improving production efficiency.
Non-Contact Processing
During laser drilling, the laser beam does not make direct contact with the material, avoiding material damage caused by mechanical stress.
High Flexibility
Laser drilling can be performed on irregular surfaces, and hole patterns or complex shapes can be set up arbitrarily.
アプリケーション・シナリオ
Optical Field
Used in the manufacture of optical components such as lenses, prisms, and beam splitters, as well as optical communication components such as fiber optic connectors and optical filters.
Semiconductor Field
Used as wafer carriers, supporting and protecting wafers for stability and safety during processing. Also used in the fabrication of photomasks.
Medical Field
Used in the manufacture of medical devices such as biosensors, enabling the detection and analysis of minute biomolecules through micro-hole structures.
Laboratory Research
Used for sample processing and analysis, using the drilled holes for sample division, grinding, and filtration. Also used as substrate or window materials in spectroscopic analysis experiments.
New Energy Field
Used in the fabrication of key components in new energy devices, such as solar cell substrates.
Chemical and Metallurgical Fields
Used to manufacture corrosion-resistant and high-temperature-resistant equipment and piping components.
よくある質問
石英ガラスは硬くて脆い材料で、物理的、化学的性質が優れ、機械的硬度が非常に高く、電気絶縁性がよく、高温と耐食性に優れ、遅延性能が低く安定で、光透過性がよい。半導体、光学、電気、化学、航空宇宙、自動車などの分野で広く使用されている。硬くて脆い材料は加工が難しく、多くの分野で刃先の倒れが小さく、材料ロスが少なく、断面粗さが小さく、切断厚さ範囲が広い切断加工が急務となっている。石英ガラスの伝統的な切断方法は機械的切断、すなわち砥石切断である。非伝統的な切断方法には、ウォータージェット切断、電気化学放電ワイヤー切断、連続レーザー切断などがある。機械的切断はコストが低いが、ホイールと材料が接触するため工具の摩耗が大きく、材料が工具によって汚染されやすい。石英ガラスはエッジ崩壊、マイクロクラック、残留応力が発生しやすく、材料の強度や性能に影響する！曲線切断が難しく、研削や研磨などの後処理が必要。レーザー切断は材料に直接触れないため、接触応力がなく、複雑な曲線切断が可能です。ピコ秒レーザーは、スポット径が小さい、精度が高い、材料との作用時間が短い、作用面積が小さいなどの利点があり、硬くて脆い材料の加工に適しています。
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