Quartz wafer boats are manufactured from high-purity quartz glass and are characterized by their high-temperature resistance and excellent chemical stability. They are primarily used in semiconductor manufacturing for carrying and processing silicon wafers. Quartz wafer boats play a critical role in semiconductor processes, ensuring the safety and stability of wafers during manufacturing while also influencing the quality and performance of the final chip products.
物件内容 | 資産価値 |
---|---|
二酸化ケイ素 | 99.99% |
密度 | 2.2×10³ kg/cm³ |
硬度 | 5.5 - 6.5 モース硬度 570 KHN 100 |
引張強度 | 4.8×10⁷ Pa (N/mm2) (7000 psi) |
圧縮強度 | >1.1×10⁹Pa (160,000 psi) |
熱膨張係数 | 5.5×10-⁷cm/cm-°C (20°C-320°C) |
熱伝導率 | 1.4 W/m-°C |
比熱 | 670 J/kg-°C |
軟化点 | 1730度C(3146度F) |
アニーリングポイント | 1210度C(2210度F) |
ストレイン・ポイント | 1120度C(2048度F) |
作業温度 | 1200°C |
電気抵抗率 | 7×10⁷Ωcm (350°C) |
サイズ | カスタマイズ |
ロゴ | カスタマイズされたロゴ |
高温耐性
Quartz wafer boats can withstand the high-temperature environments encountered in semiconductor manufacturing, typically tolerating temperatures up to 1100 degrees Celsius and above.
High-Purity Material
Quartz wafer boats are made from high-purity quartz glass, generally exceeding 99.999% purity, ensuring that no impurities are introduced during semiconductor manufacturing.
Chemical Stability
Quartz wafer boats are inert to a variety of chemicals, maintaining stability in diverse chemical environments, and do not react with chemicals used in semiconductor processes.
Excellent Optical Properties
Quartz wafer boats possess excellent optical transmission, allowing light to pass through across the ultraviolet to infrared spectrum. This is crucial for semiconductor manufacturing processes that require optical inspection.
アプリケーション・シナリオ
High-Temperature Processing
Quartz wafer boats play a critical role in semiconductor manufacturing processes that require high-temperature treatment, such as diffusion and oxidation. They maintain stability at temperatures exceeding 300°C, preventing melting or deformation, thus ensuring the safety of the silicon wafers.
High-Temperature Zone Components
In the semiconductor field, quartz wafer boats are used as components in high-temperature zones, primarily for furnace tubes and boat frames used in processes like diffusion and oxidation. They come into direct or indirect contact with silicon wafers in high-temperature environments.
The primary material of quartz wafer boats is high-purity quartz glass, which contains an extremely high proportion of silicon dioxide (SiO₂), typically with a purity exceeding 99.999%. This high-purity quartz glass ensures that no impurities are introduced during semiconductor manufacturing, while also exhibiting excellent high-temperature resistance and chemical stability.
Quartz wafer boats primarily serve as tools for carrying and transporting silicon wafers in semiconductor manufacturing. They are used in critical process steps, such as high-temperature processing, cleaning, and chemical processing, ensuring the stability and safety of the silicon wafers. The high-temperature resistance and chemical stability of quartz wafer boats are crucial for ensuring product quality in semiconductor manufacturing.
The lifespan of quartz wafer boats is influenced by various factors, including frequency of use, temperature, and chemical environment. Generally, with proper usage and maintenance, quartz wafer boats can be reused multiple times. However, with increased use, they may gradually lose performance due to wear, contamination, or the formation of micro-cracks. It becomes necessary to replace the wafer boat to ensure process stability and product reliability. The specific lifespan needs to be determined based on actual use and maintenance conditions.
よくある質問
石英ガラスは硬くて脆い材料で、物理的、化学的性質が優れ、機械的硬度が非常に高く、電気絶縁性がよく、高温と耐食性に優れ、遅延性能が低く安定で、光透過性がよい。半導体、光学、電気、化学、航空宇宙、自動車などの分野で広く使用されている。硬くて脆い材料は加工が難しく、多くの分野で刃先の倒れが小さく、材料ロスが少なく、断面粗さが小さく、切断厚さ範囲が広い切断加工が急務となっている。石英ガラスの伝統的な切断方法は機械的切断、すなわち砥石切断である。非伝統的な切断方法には、ウォータージェット切断、電気化学放電ワイヤー切断、連続レーザー切断などがある。機械的切断はコストが低いが、ホイールと材料が接触するため工具の摩耗が大きく、材料が工具によって汚染されやすい。石英ガラスはエッジ崩壊、マイクロクラック、残留応力が発生しやすく、材料の強度や性能に影響する!曲線切断が難しく、研削や研磨などの後処理が必要。レーザー切断は材料に直接触れないため、接触応力がなく、複雑な曲線切断が可能です。ピコ秒レーザーは、スポット径が小さい、精度が高い、材料との作用時間が短い、作用面積が小さいなどの利点があり、硬くて脆い材料の加工に適しています。
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