Quartz wafer boats are manufactured from high-purity quartz glass and are characterized by their high-temperature resistance and excellent chemical stability. They are primarily used in semiconductor manufacturing for carrying and processing silicon wafers. Quartz wafer boats play a critical role in semiconductor processes, ensuring the safety and stability of wafers during manufacturing while also influencing the quality and performance of the final chip products.
속성 콘텐츠 | 속성 값 |
---|---|
SiO2 | 99.99% |
밀도 | 2.2×10³ kg/cm³ |
경도 | 5.5 - 6.5 모스 스케일 570 KHN 100 |
인장 강도 | 4.8×10⁷ Pa(N/mm2)(7000psi) |
압축 강도 | >1.1×10⁹ Pa(160,000psi) 이상 |
열팽창 계수 | 5.5×10-⁷ cm/cm-°C(20°C-320°C) |
열 전도성 | 1.4W/m-°C |
비열 | 670 J/kg-°C |
연화 포인트 | 1730°C(3146°F) |
어닐링 포인트 | 1210°C(2210°F) |
스트레인 포인트 | 1120°C(2048°F) |
작업 온도 | 1200°C(2192°F) |
전기 저항 | 7×10⁷ 옴 cm(350°C) |
크기 | 사용자 지정 |
로고 | 맞춤형 로고 수락 |
고온 내성
Quartz wafer boats can withstand the high-temperature environments encountered in semiconductor manufacturing, typically tolerating temperatures up to 1100 degrees Celsius and above.
High-Purity Material
Quartz wafer boats are made from high-purity quartz glass, generally exceeding 99.999% purity, ensuring that no impurities are introduced during semiconductor manufacturing.
화학적 안정성
Quartz wafer boats are inert to a variety of chemicals, maintaining stability in diverse chemical environments, and do not react with chemicals used in semiconductor processes.
Excellent Optical Properties
Quartz wafer boats possess excellent optical transmission, allowing light to pass through across the ultraviolet to infrared spectrum. This is crucial for semiconductor manufacturing processes that require optical inspection.
애플리케이션 시나리오
High-Temperature Processing
Quartz wafer boats play a critical role in semiconductor manufacturing processes that require high-temperature treatment, such as diffusion and oxidation. They maintain stability at temperatures exceeding 300°C, preventing melting or deformation, thus ensuring the safety of the silicon wafers.
High-Temperature Zone Components
In the semiconductor field, quartz wafer boats are used as components in high-temperature zones, primarily for furnace tubes and boat frames used in processes like diffusion and oxidation. They come into direct or indirect contact with silicon wafers in high-temperature environments.
The primary material of quartz wafer boats is high-purity quartz glass, which contains an extremely high proportion of silicon dioxide (SiO₂), typically with a purity exceeding 99.999%. This high-purity quartz glass ensures that no impurities are introduced during semiconductor manufacturing, while also exhibiting excellent high-temperature resistance and chemical stability.
Quartz wafer boats primarily serve as tools for carrying and transporting silicon wafers in semiconductor manufacturing. They are used in critical process steps, such as high-temperature processing, cleaning, and chemical processing, ensuring the stability and safety of the silicon wafers. The high-temperature resistance and chemical stability of quartz wafer boats are crucial for ensuring product quality in semiconductor manufacturing.
The lifespan of quartz wafer boats is influenced by various factors, including frequency of use, temperature, and chemical environment. Generally, with proper usage and maintenance, quartz wafer boats can be reused multiple times. However, with increased use, they may gradually lose performance due to wear, contamination, or the formation of micro-cracks. It becomes necessary to replace the wafer boat to ensure process stability and product reliability. The specific lifespan needs to be determined based on actual use and maintenance conditions.
자주 묻는 질문
석영 유리는 우수한 물리적 및 화학적 특성, 매우 높은 기계적 경도, 우수한 전기 절연성, 고온 및 내식성, 낮고 안정적인 지연 성능, 우수한 빛 투과율 등을 갖춘 단단하고 부서지기 쉬운 소재입니다. 반도체, 광학, 전기, 화학, 항공우주, 자동차 및 기타 분야에서 널리 사용됩니다. 단단하고 부서지기 쉬운 재료는 가공이 어렵고 많은 분야에서 가장자리 붕괴가 적고 재료 손실이 적으며 단면 거칠기가 낮고 절단 두께 범위가 넓은 절단 공정이 절실히 필요합니다. 석영 유리의 전통적인 절단 방법은 기계식 절단, 즉 휠 절단입니다. 비 전통적인 절단 방법에는 워터젯 절단, 전기 화학 방전 와이어 절단, 연속 레이저 절단 등이 포함됩니다. 기계식 절단은 비용이 저렴하지만 휠과 재료 사이의 접촉으로 인해 공구 마모가 크고 재료가 공구에 의해 쉽게 오염됩니다. 석영 유리는 가장자리 붕괴, 미세 균열 및 잔류 응력이 발생하기 쉬우므로 재료의 강도와 성능에 영향을 미칩니다! 곡선 절단이 어렵고 연마 및 연마와 같은 후처리가 필요합니다. 레이저 절단은 재료에 직접 접촉하지 않고 접촉 응력이 없으며 복잡한 곡선 절단을 수행할 수 있습니다. 피코초 레이저는 작은 스폿 직경, 고정밀, 재료와의 짧은 작용 시간, 작은 작용 면적의 장점을 가지고 있으며 단단하고 부서지기 쉬운 재료의 가공에 적합합니다.
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