Quartz Tube
Quartz Plate
Quartz Rod
Optical Applications
Semiconductor Industry
Laboratory and Chemical Applications
Quartz laser-drilled glass plates refer to products in which holes are created on quartz glass plates using laser drilling technology. Quartz glass, due to its excellent properties such as high light transmission, high hardness, high-temperature resistance, and corrosion resistance, is widely used in many fields. Laser drilling technology, with its high precision, high efficiency, and non-contact nature, has become an important method for processing quartz glass plates.
The principle behind laser drilling of quartz glass plates mainly involves using a high-energy density laser beam to focus and locally heat the quartz glass. This causes the quartz glass to undergo thermal expansion, thereby creating holes at the designated locations. The high energy and precise focusing of the laser beam result in a highly accurate and rapid processing, while also avoiding material damage and stress concentrations that can occur with traditional mechanical drilling methods.
| Property Content | Property Values |
|---|---|
| SiO2 | 99.99% |
| Density | 2.2×10³ kg/cm³ |
| Hardness | 5.5 - 6.5 Mohs' Scale 570 KHN 100 |
| Tensile Strength | 4.8×10⁷ Pa (N/mm2) (7000 psi) |
| Compression Strength | >1.1×10⁹ Pa (160,000 psi) |
| Coefficient of Thermal Expansion | 5.5×10⁻⁷ cm/cm·°C (20°C-320°C) |
| Thermal Conductivity | 1.4 W/m·°C |
| Specific Heat | 670 J/kg·°C |
| Softening Point | 1730°C (3146°F) |
| Annealing Point | 1210°C (2210°F) |
| Strain Point | 1120°C (2048°F) |
| Work Temperature | 1200°C (2192°F) |
| Electrical Resistivity | 7×10⁷ ohm cm (350°C) |
| Size | Customized |
| Logo | Customized Logo Accept |
JGS1
Commonly known as UV-grade fused silica, this material exhibits exceptionally low dispersion and very high transmittance in the ultraviolet (UV) spectral range.
JGS2
Similar to JGS1, but may have variations in specific performance parameters such as transmittance and thermal expansion coefficient, depending on the manufacturer’s standards.
JGS3
Typically used in applications requiring higher purity or specialized performance characteristics. Specific performance parameters can vary based on the manufacturer.
High Precision
Laser drilling technology can achieve processing precision at the micrometer and even nanometer level, meeting the requirements of high-precision applications.
High Efficiency
Laser drilling speeds are much faster than traditional mechanical drilling methods, significantly improving production efficiency.
Non-Contact Processing
During laser drilling, the laser beam does not make direct contact with the material, avoiding material damage caused by mechanical stress.
High Flexibility
Laser drilling can be performed on irregular surfaces, and hole patterns or complex shapes can be set up arbitrarily.
Application Scenario
Optical Field
Used in the manufacture of optical components such as lenses, prisms, and beam splitters, as well as optical communication components such as fiber optic connectors and optical filters.
Semiconductor Field
Used as wafer carriers, supporting and protecting wafers for stability and safety during processing. Also used in the fabrication of photomasks.
Medical Field
Used in the manufacture of medical devices such as biosensors, enabling the detection and analysis of minute biomolecules through micro-hole structures.
Laboratory Research
Used for sample processing and analysis, using the drilled holes for sample division, grinding, and filtration. Also used as substrate or window materials in spectroscopic analysis experiments.
New Energy Field
Used in the fabrication of key components in new energy devices, such as solar cell substrates.
Chemical and Metallurgical Fields
Used to manufacture corrosion-resistant and high-temperature-resistant equipment and piping components.
Frequently asked questions
Quartz glass is a hard and brittle material with excellent physical and chemical properties, extremely high mechanical hardness, good electrical insulation, high temperature and corrosion resistance, low and stable delay performance, good light transmittance, etc. It is widely used in semiconductors, optics, electricity, chemistry, aerospace, automobiles and other fields. Hard and brittle materials are difficult to process, and many fields urgently need cutting processes with small edge collapse, less material loss, low cross-section roughness, and a wide cutting thickness range. The traditional cutting method of quartz glass is mechanical cutting, that is, wheel cutting. Non-traditional cutting methods include water jet cutting, electrochemical discharge wire cutting, continuous laser cutting, etc. Mechanical cutting has low cost, but the contact between the wheel and the material causes large tool wear, and the material is easily contaminated by the tool. Quartz glass is prone to edge collapse, microcracks, and residual stress, which affects the strength and performance of the material! It is difficult to achieve curve cutting and requires post-processing, such as grinding and polishing. Laser cutting does not directly contact the material, has no contact stress, and can perform complex curve cutting. Picosecond laser has the advantages of small spot diameter, high precision, short action time with the material, and small action area, and is suitable for the processing of hard and brittle materials.
。
