Quartz Tube
Quartz Plate
Quartz Rod
Optical Applications
Semiconductor Industry
Laboratory and Chemical Applications
A quartz silicon wafer cleaning tank is a specialized piece of equipment used for cleaning quartz silicon wafers or similar materials. Its construction and design are typically based on the superior properties of quartz, such as high temperature resistance, corrosion resistance, and high optical transmittance.
| Property Content | Property Values |
|---|---|
| SiO2 | 99.99% |
| Density | 2.2×10³ kg/cm³ |
| Hardness | 5.5 - 6.5 Mohs' Scale 570 KHN 100 |
| Tensile Strength | 4.8×10⁷ Pa (N/mm2) (7000 psi) |
| Compression Strength | >1.1×10⁹ Pa (160,000 psi) |
| Coefficient of Thermal Expansion | 5.5×10⁻⁷ cm/cm·°C (20°C-320°C) |
| Thermal Conductivity | 1.4 W/m·°C |
| Specific Heat | 670 J/kg·°C |
| Softening Point | 1730°C (3146°F) |
| Annealing Point | 1210°C (2210°F) |
| Strain Point | 1120°C (2048°F) |
| Work Temperature | 1200°C (2192°F) |
| Electrical Resistivity | 7×10⁷ ohm cm (350°C) |
| Size | Customized |
| Logo | Customized Logo Accept |
High-Temperature Resistance
Quartz material possesses a high melting point, allowing it to maintain stable performance at elevated temperatures, making it suitable for applications that require high-temperature cleaning processes.
Corrosion Resistance
Quartz exhibits excellent resistance to corrosion from most acids, with the exception of hydrofluoric acid. This property allows it to withstand the corrosive effects of a variety of cleaning agents.
High Transparency
Although the cleaning tank itself does not require transparency, the high transparency of quartz indicates its high material purity, which helps maintain the cleanliness of the cleaning environment.
Application Scenario
Quartz wafer cleaning tanks are widely utilized in sectors such as semiconductor manufacturing and the photovoltaic industry for cleaning silicon wafers and high-precision materials like optical components. In semiconductor fabrication, silicon wafer cleaning is a crucial step for ensuring chip quality. In the photovoltaic industry, cleaning silicon wafers is essential for enhancing the conversion efficiency of solar panels.
Quartz wafer cleaning tanks are primarily used in semiconductor manufacturing for high-precision cleaning of silicon wafers. This process is designed to remove particles, organic matter, metal ions, and other contaminants from the wafer’s surface, ensuring the surface cleanliness meets the stringent requirements of semiconductor fabrication.
The typical operating procedure includes steps such as wafer loading, chemical cleaning, deionized water rinsing, spin-drying, and final drying. The specific operation details must be followed based on the equipment’s model and user manual.
The effectiveness of the cleaning process can be evaluated using various methods, including surface particle counting, metal ion residue detection, and surface roughness measurement. These evaluations typically require specialized testing equipment and trained personnel.
quartz waste liquid bottle
Quartz source bottle
Quartz wafer cleaning tank
quartz wafer cleaning racks
Quartz cage boat
Quartz boat carrier
Frequently asked questions
Quartz glass is a hard and brittle material with excellent physical and chemical properties, extremely high mechanical hardness, good electrical insulation, high temperature and corrosion resistance, low and stable delay performance, good light transmittance, etc. It is widely used in semiconductors, optics, electricity, chemistry, aerospace, automobiles and other fields. Hard and brittle materials are difficult to process, and many fields urgently need cutting processes with small edge collapse, less material loss, low cross-section roughness, and a wide cutting thickness range. The traditional cutting method of quartz glass is mechanical cutting, that is, wheel cutting. Non-traditional cutting methods include water jet cutting, electrochemical discharge wire cutting, continuous laser cutting, etc. Mechanical cutting has low cost, but the contact between the wheel and the material causes large tool wear, and the material is easily contaminated by the tool. Quartz glass is prone to edge collapse, microcracks, and residual stress, which affects the strength and performance of the material! It is difficult to achieve curve cutting and requires post-processing, such as grinding and polishing. Laser cutting does not directly contact the material, has no contact stress, and can perform complex curve cutting. Picosecond laser has the advantages of small spot diameter, high precision, short action time with the material, and small action area, and is suitable for the processing of hard and brittle materials.
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