Quartz wafers are high-purity materials characterized by their high temperature resistance, corrosion resistance, excellent optical properties, and electrical insulation capabilities. They are widely used in the semiconductor and optics industries. Additionally, their piezoelectric effect makes them key components in electronic devices such as crystal oscillators and sensors.
Property Content | Property Values |
---|---|
SiO2 | 99.99% |
Density | 2.2×10³ kg/cm³ |
Hardness | 5.5 - 6.5 Mohs' Scale 570 KHN 100 |
Tensile Strength | 4.8×10⁷ Pa (N/mm2) (7000 psi) |
Compression Strength | >1.1×10⁹ Pa (160,000 psi) |
Coefficient of Thermal Expansion | 5.5×10⁻⁷ cm/cm·°C (20°C-320°C) |
Thermal Conductivity | 1.4 W/m·°C |
Specific Heat | 670 J/kg·°C |
Softening Point | 1730°C (3146°F) |
Annealing Point | 1210°C (2210°F) |
Strain Point | 1120°C (2048°F) |
Work Temperature | 1200°C (2192°F) |
Electrical Resistivity | 7×10⁷ ohm cm (350°C) |
Size | Customized |
Logo | Customized Logo Accept |
High Purity and Transparency
Quartz wafers are made from high-purity silicon dioxide and exhibit extremely high transparency, making them ideal for optical applications, particularly across the ultraviolet to infrared spectrum.
High-Temperature Resistance
Quartz wafers can withstand very high temperatures, with a softening point around 1730°C. They can be used for extended periods at 1100°C and withstand temperatures up to 1450°C for short durations, making them suitable for high-temperature process environments.
Chemical Stability
Quartz wafers exhibit high resistance to most chemicals, except for hydrofluoric acid. This makes them very stable in both chemical laboratory and industrial applications.
Piezoelectric Effect
Single-crystal quartz wafers possess a piezoelectric effect, meaning they generate an electrical charge when subjected to mechanical stress. This property is crucial in the manufacturing of electronic devices like crystal oscillators and sensors.
Application Scenario
Semiconductor Manufacturing
Quartz wafers play a crucial role in semiconductor manufacturing, especially in silicon wafer fabrication and wafer processing. They are used to create quartz crucibles for wafer IC carriers (single crystal pulling) and as quartz components, such as quartz diffusion tubes, quartz flanges, and quartz furnace tubes, in processes like oxidation, epitaxy, photolithography, etching, and diffusion.
Quartz wafers are essential in semiconductor manufacturing because they provide a high-temperature resistant, chemically stable, and electrically insulating substrate. This is indispensable for wafer processing and integrated circuit fabrication. The purity and physical properties of quartz wafers directly impact the performance and reliability of semiconductor devices.
The high transparency and broad spectral transmission of quartz wafers make them ideal materials for manufacturing high-end optical components, such as lenses, windows, and filters. These properties ensure effective light transmission and precise control, which are critical for enhancing the performance of optical systems.
The piezoelectric effect of quartz wafers makes them widely applicable in electronic devices, particularly in the manufacturing of crystal oscillators and sensors. The piezoelectric effect allows quartz wafers to generate an electrical charge when subjected to mechanical stress, which is crucial for precisely controlling frequencies and measuring minute changes.
Frequently asked questions
Quartz glass is a hard and brittle material with excellent physical and chemical properties, extremely high mechanical hardness, good electrical insulation, high temperature and corrosion resistance, low and stable delay performance, good light transmittance, etc. It is widely used in semiconductors, optics, electricity, chemistry, aerospace, automobiles and other fields. Hard and brittle materials are difficult to process, and many fields urgently need cutting processes with small edge collapse, less material loss, low cross-section roughness, and a wide cutting thickness range. The traditional cutting method of quartz glass is mechanical cutting, that is, wheel cutting. Non-traditional cutting methods include water jet cutting, electrochemical discharge wire cutting, continuous laser cutting, etc. Mechanical cutting has low cost, but the contact between the wheel and the material causes large tool wear, and the material is easily contaminated by the tool. Quartz glass is prone to edge collapse, microcracks, and residual stress, which affects the strength and performance of the material! It is difficult to achieve curve cutting and requires post-processing, such as grinding and polishing. Laser cutting does not directly contact the material, has no contact stress, and can perform complex curve cutting. Picosecond laser has the advantages of small spot diameter, high precision, short action time with the material, and small action area, and is suitable for the processing of hard and brittle materials.
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