Quartz discs are a material characterized by excellent high-temperature resistance, corrosion resistance, thermal stability, and light transmission properties, making them widely applicable in fields such as semiconductors, optical instruments, and communication devices. In the fabrication of quartz crystal resonators, the choice of their shape significantly impacts performance, including vibrational activity and the consistency of frequency-temperature characteristic curves.
Property Content | Property Values |
---|---|
SiO2 | 99.99% |
Density | 2.2×10³ kg/cm³ |
Hardness | 5.5 - 6.5 Mohs' Scale 570 KHN 100 |
Tensile Strength | 4.8×10⁷ Pa (N/mm2) (7000 psi) |
Compression Strength | >1.1×10⁹ Pa (160,000 psi) |
Coefficient of Thermal Expansion | 5.5×10⁻⁷ cm/cm·°C (20°C-320°C) |
Thermal Conductivity | 1.4 W/m·°C |
Specific Heat | 670 J/kg·°C |
Softening Point | 1730°C (3146°F) |
Annealing Point | 1210°C (2210°F) |
Strain Point | 1120°C (2048°F) |
Work Temperature | 1200°C (2192°F) |
Electrical Resistivity | 7×10⁷ ohm cm (350°C) |
Size | Customized |
Logo | Customized Logo Accept |
High Purity and Transparency
Quartz discs are made from high-purity silicon dioxide and exhibit exceptional transparency, particularly across the ultraviolet to infrared spectral range. This makes them ideally suited for optical applications.
High-Temperature Resistance
Quartz discs can withstand extremely high temperatures, with a softening point around 1730°C, and can be used continuously at 1100°C, and can tolerate short-term temperatures up to 1450°C. This makes them suitable for high-temperature environments.
Chemical Stability
Quartz discs demonstrate excellent resistance to most chemicals, with the exception of hydrofluoric acid, making them very stable for chemical laboratory and industrial uses.
Low Thermal Expansion Coefficient
Quartz discs have a very low thermal expansion coefficient, which means their dimensions change very little with temperature variations. This is essential for applications requiring precise dimensional control, such as in precision instruments and high-temperature equipment.
Application Scenario
Semiconductor Industry
Quartz discs play a significant role in semiconductor manufacturing, serving as carriers and processing substrates for wafers. They are used in critical process steps such as photolithography, oxidation, diffusion, and chemical vapor deposition, which demand extremely high levels of purity, temperature resistance, and dimensional precision.
In semiconductor manufacturing, quartz discs primarily serve as carriers and substrates for silicon wafers during processing. They are utilized as base materials in crucial process steps like photolithography, oxidation, diffusion, and chemical vapor deposition (CVD). Their high temperature resistance, chemical inertness, and precise dimensional control are essential for ensuring the performance of semiconductor devices.
The optical properties of quartz discs are critical because their applications in the optoelectronics industry require high transparency and broad spectral transmission. These characteristics make quartz discs ideal materials for manufacturing optical lenses, prisms, windows, and other optical components. They are also well-suited for use in laser equipment and optical communication systems.
In LED manufacturing, quartz discs primarily function as high-temperature and chemical-resistant support materials. They provide stable physical support and protection for LED chips during the fabrication process, especially under high-temperature and corrosive environments, ensuring the stability of the production process and the quality of the final products.
Frequently asked questions
Quartz glass is a hard and brittle material with excellent physical and chemical properties, extremely high mechanical hardness, good electrical insulation, high temperature and corrosion resistance, low and stable delay performance, good light transmittance, etc. It is widely used in semiconductors, optics, electricity, chemistry, aerospace, automobiles and other fields. Hard and brittle materials are difficult to process, and many fields urgently need cutting processes with small edge collapse, less material loss, low cross-section roughness, and a wide cutting thickness range. The traditional cutting method of quartz glass is mechanical cutting, that is, wheel cutting. Non-traditional cutting methods include water jet cutting, electrochemical discharge wire cutting, continuous laser cutting, etc. Mechanical cutting has low cost, but the contact between the wheel and the material causes large tool wear, and the material is easily contaminated by the tool. Quartz glass is prone to edge collapse, microcracks, and residual stress, which affects the strength and performance of the material! It is difficult to achieve curve cutting and requires post-processing, such as grinding and polishing. Laser cutting does not directly contact the material, has no contact stress, and can perform complex curve cutting. Picosecond laser has the advantages of small spot diameter, high precision, short action time with the material, and small action area, and is suitable for the processing of hard and brittle materials.
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