Quarzrohr
Quarzplatte
Quarzstab
Optische Anwendungen
Halbleiterindustrie
Labor- und Chemieanwendungen
Quartz wafer boats are manufactured from high-purity quartz glass and are characterized by their high-temperature resistance and excellent chemical stability. They are primarily used in semiconductor manufacturing for carrying and processing silicon wafers. Quartz wafer boats play a critical role in semiconductor processes, ensuring the safety and stability of wafers during manufacturing while also influencing the quality and performance of the final chip products.
| Eigenschaft Inhalt | Immobilienwerte |
|---|---|
| SiO2 | 99.99% |
| Dichte | 2,2×10³ kg/cm³ |
| Härte | 5,5 - 6,5 Mohs'sche Skala 570 KHN 100 |
| Zugfestigkeit | 4,8×10⁷ Pa (N/mm2) (7000 psi) |
| Druckfestigkeit | >1,1×10⁹ Pa (160.000 psi) |
| Wärmeausdehnungskoeffizient | 5,5×10-⁷ cm/cm-°C (20°C-320°C) |
| Wärmeleitfähigkeit | 1,4 W/m-°C |
| Spezifische Wärme | 670 J/kg-°C |
| Erweichungspunkt | 1730°C (3146°F) |
| Glühpunkt | 1210°C (2210°F) |
| Dehnungspunkt | 1120°C (2048°F) |
| Arbeitstemperatur | 1200°C (2192°F) |
| Elektrischer spezifischer Widerstand | 7×10⁷ Ohm cm (350°C) |
| Größe | Kundenspezifisch |
| Logo | Kundenspezifisches Logo akzeptieren |
Hochtemperaturbeständigkeit
Quartz wafer boats can withstand the high-temperature environments encountered in semiconductor manufacturing, typically tolerating temperatures up to 1100 degrees Celsius and above.
High-Purity Material
Quartz wafer boats are made from high-purity quartz glass, generally exceeding 99.999% purity, ensuring that no impurities are introduced during semiconductor manufacturing.
Chemical Stability
Quartz wafer boats are inert to a variety of chemicals, maintaining stability in diverse chemical environments, and do not react with chemicals used in semiconductor processes.
Excellent Optical Properties
Quartz wafer boats possess excellent optical transmission, allowing light to pass through across the ultraviolet to infrared spectrum. This is crucial for semiconductor manufacturing processes that require optical inspection.
Anwendungsszenario
High-Temperature Processing
Quartz wafer boats play a critical role in semiconductor manufacturing processes that require high-temperature treatment, such as diffusion and oxidation. They maintain stability at temperatures exceeding 300°C, preventing melting or deformation, thus ensuring the safety of the silicon wafers.
Annealing Processes
In semiconductor manufacturing, annealing is used to restore or alter material properties through heating. Quartz wafer boats are an ideal choice for this process due to their stability at high temperatures.
Cleaning and Chemical Processing
Quartz wafer boats exhibit excellent chemical stability during cleaning and chemical processing where chips might be treated with acidic solutions, protecting the chips from corrosion.
High-Temperature Zone Components
In the semiconductor field, quartz wafer boats are used as components in high-temperature zones, primarily for furnace tubes and boat frames used in processes like diffusion and oxidation. They come into direct or indirect contact with silicon wafers in high-temperature environments.
The primary material of quartz wafer boats is high-purity quartz glass, which contains an extremely high proportion of silicon dioxide (SiO₂), typically with a purity exceeding 99.999%. This high-purity quartz glass ensures that no impurities are introduced during semiconductor manufacturing, while also exhibiting excellent high-temperature resistance and chemical stability.
Quartz wafer boats primarily serve as tools for carrying and transporting silicon wafers in semiconductor manufacturing. They are used in critical process steps, such as high-temperature processing, cleaning, and chemical processing, ensuring the stability and safety of the silicon wafers. The high-temperature resistance and chemical stability of quartz wafer boats are crucial for ensuring product quality in semiconductor manufacturing.
The lifespan of quartz wafer boats is influenced by various factors, including frequency of use, temperature, and chemical environment. Generally, with proper usage and maintenance, quartz wafer boats can be reused multiple times. However, with increased use, they may gradually lose performance due to wear, contamination, or the formation of micro-cracks. It becomes necessary to replace the wafer boat to ensure process stability and product reliability. The specific lifespan needs to be determined based on actual use and maintenance conditions.
Häufig gestellte Fragen
Quarzglas ist ein hartes und sprödes Material mit ausgezeichneten physikalischen und chemischen Eigenschaften, extrem hoher mechanischer Härte, guter elektrischer Isolierung, hoher Temperatur- und Korrosionsbeständigkeit, geringer und stabiler Verzögerungsleistung, guter Lichtdurchlässigkeit usw. Es findet breite Anwendung in der Halbleiterindustrie, Optik, Elektrizität, Chemie, Luft- und Raumfahrt, Automobilindustrie und anderen Bereichen. Harte und spröde Werkstoffe sind schwer zu bearbeiten, und in vielen Bereichen werden dringend Schneidverfahren mit geringem Kanteneinbruch, geringem Materialverlust, geringer Querschnittsrauheit und einem großen Schnittdickenbereich benötigt. Das traditionelle Schneidverfahren für Quarzglas ist das mechanische Schneiden, d. h. das Scheibenschneiden. Zu den nicht-traditionellen Schneidverfahren gehören Wasserstrahlschneiden, elektrochemisches Drahterodieren, kontinuierliches Laserschneiden usw. Das mechanische Schneiden ist kostengünstig, aber der Kontakt zwischen der Scheibe und dem Material verursacht einen hohen Werkzeugverschleiß, und das Material wird leicht durch das Werkzeug verschmutzt. Quarzglas neigt zu Kanteneinbrüchen, Mikrorissen und Eigenspannungen, was die Festigkeit und Leistung des Materials beeinträchtigt! Das Schneiden von Kurven ist schwierig und erfordert Nachbearbeitungen wie Schleifen und Polieren. Das Laserschneiden kommt nicht direkt mit dem Material in Berührung, hat keine Kontaktspannungen und kann komplexe Kurvenschnitte durchführen. Der Pikosekundenlaser hat die Vorteile eines kleinen Punktdurchmessers, einer hohen Präzision, einer kurzen Einwirkungszeit auf das Material und eines kleinen Einwirkungsbereichs und eignet sich für die Bearbeitung von harten und spröden Materialien.
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